Associate Engineer, Equipment

About Company

Company Name STATS ChipPAC Pte Ltd
Company UEN 199407932D

Job Detail

Responsible for maintenance and repair of Wafer Process related systems such as Endura PVD, nexx PVD and Descum machine. Perform set-up and conversion to support production in thin film. Develops creative and innovative solutions to problems with considerable initiative and independent thought. Acts independently to determine methods and procedures and may provide guidance to less experienced team members Communicates with engineers, peer specialist or external vendors to resolve problems and to provide advanced training to less experienced technical specialists To identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing costs

Job Requirements

Knowledge of practical applications of concepts, procedures and guidelines to solve complex problems Knowledge in electronics and mechanical principles and thorough understanding of process technology Diploma in Electrical / Electronics / Mechanical / Mechatronics Engineering or its equivalent 2 years experience in mass production semiconductor manufacturing environment are preferred Certificate of Electrical/ Electronics/ Mechanical/ Mechatronics Engineering or its equivalent with minimum of 6 years experience in equipment support Able to work 12 hour rotating shifts

Job Title Associate Engineer, Equipment
Salary SGD2,600.00 - 3,800.00
Employment Type Full Time
Working Experience 2 Years
Qualification GCE N Level / Nitec