Associate Engineer, Process

Job Detail

In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and Positive, Negative. Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners). Setup recipe for new devices. Process characterization for every new device: coating thickness, exposure recipe and CD after develop. Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity. Perform continuous improvement activities for top defects, process simplification and throughput improvement. Monitor process capability in terms of input parameter control and SPC monitoring