| Company Name | STATS ChipPAC Pte Ltd |
|---|---|
| Company UEN | 199407932D |
Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. To provide interim and long-term corrective actions for any discrepancies. Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
Requires Degree in Electrical, Electronics, Mechanical or Materials Engineering or equivalent Minimum 2 years of relevant experience in wafer bumping or wafer fabrication Fresh Degree with Engineering are welcomed
| Job Title | Engineer |
|---|---|
| Salary | SGD4,000.00 - 0.00 |
| Employment Type | Full Time |
| Working Experience | 2 Years |