Manufacturing Career Opportunitunies - Micron Semiconductor Asia Operations

1. Engineer, Probe Shift Equipment

Job Description

• Lead and manage a team of shift equipment technicians to achieve equipment schedules, production standards, and operational cost targets.
• Set clear performance expectations, provide feedback, and implement improvement plans.
• Ensure compliance with safety and SOP standards through proper training.
• Conduct data analysis and root cause investigations to resolve equipment issues.
• Collaborate with management, production, process, engineering, and training teams to meet business objectives.
• Review and optimize SOPs to ensure relevance and efficiency.
• Evaluate, promote, and plan for new equipment and materials.
• Foster teamwork, employee engagement, and effective communication across teams.

Job Requirements

• Bachelor’s degree in Electrical & Electronics, Chemical, Mechanical, or Materials Engineering (or equivalent).
• Demonstrated leadership skills through academic, professional, or project experience.
• Strong problem-solving abilities with knowledge of 8D, 5 Whys, and FMEA.
• Excellent communication skills and ability to work in fast-paced environments.
• Proficiency in Microsoft Office Suite.
• Internship or prior experience in probe engineering within a semiconductor environment preferred.
• Hands-on project experience in equipment operations or troubleshooting an advantage.

2. Engineer, Advanced Packaging Process & Equipment Technology Development

Job Description

• Develop and optimize assembly processes for advanced packaging technologies (e.g., wafer-level packaging, die stacking, Chip on Wafer, Chip to Wafer).
• Drive improvements in product quality, yield, reducing cost, and enhancing productivity.
• Evaluate and implement new equipment and materials to enhance capabilities.
• Establish and maintain process parameters across semiconductor equipment.
• Ensure process defense coverage through measurement, inspection, and testing.
• Conduct continuous data analysis for process control and improvement opportunities.
• Collaborate across integration, assembly, wafer fab, product engineering, and quality teams to support technology launches.
• Manage smooth transitions from R&D to high-volume manufacturing (HVM).
• Provide POR (Process of Record) and MOR (Model of Record) documentation for production transfer.

Job Requirements

• Bachelor’s or Master’s degree in Materials, Mechanical, Chemical, or Electrical Engineering.
• Experience in advanced packaging technologies and process development.
• Strong problem-solving and analytical skills, with statistical process control experience.
• Knowledge of equipment qualification, new material evaluation, and integration flows.
• Ability to work cross-functionally with global engineering teams.
• Excellent communication, documentation, and project coordination skills.
• Prior semiconductor packaging experience highly preferred.

3. Engineer, Test Solutions Engineering

Job Description

• Develop, debug, and maintain test programs for advanced memory devices, including HBM.
• Design test algorithms, covering software, hardware, defect coverage, and test times.
• Lead new product introduction (NPI) and manage pre/post silicon test activities.
• Develop test automation solutions and validate new test equipment.
• Independently debug test issues, perform root cause analysis, and propose solutions.
• Provide statistical analysis for test validation and ensure program quality.
• Collaborate with global teams to verify yield and quality for customer shipments.
• Support yield and capacity improvement experiments with internal and external partners.
• Drive cost-of-test reduction and continuous improvement initiatives.

Job Requirements

• Bachelor’s degree in Electrical, Computer, or Electronics Engineering.
• Strong coding skills in Python and C, with experience in automated test equipment.
• Proven experience in test program development and validation.
• Strong statistical analysis and problem-solving skills.
• Knowledge of memory device architecture and testing methodologies.
• Excellent communication, collaboration, and project management abilities.
• Semiconductor test engineering or NPI experience preferred.

4. Manufacturing Engineer

Job Description

• Plan and execute production schedules to achieve output, OTD, cycle time, and inventory targets.
• Monitor daily production and resolve issues with cross-functional teams.
• Develop and implement systems for materials flow, inventory, and process efficiency.
• Drive continuous improvement for best-in-class performance in cycle time and delivery.
• Act as the main contact for production control and in-line planning activities.
• Forecast production materials and resources to ensure readiness.
• Analyze bottlenecks and collaborate with support groups for resolution.
• Maintain safe work practices and perform safety inspections.

Job Requirements

• Bachelor’s degree in Industrial, Mechanical, or Manufacturing Engineering.
• Experience in production planning, scheduling, and process improvement.
• Strong problem-solving and analytical skills.
• Knowledge of Lean, Six Sigma, or Kaizen methodologies preferred.
• Excellent communication, collaboration, and organizational skills.
• Familiarity with ERP/MRP systems and production planning tools.

5. Manufacturing Equipment / Production Engineer

Job Description

• Plan, schedule, and implement new tool installations, relocations, and retrofits.
• Develop and maintain equipment maintenance procedures and preventive schedules.
• Monitor equipment performance, availability, and reliability.
• Collaborate with process owners and vendors for equipment and process improvements.
• Serve as liaison between facilities, vendors, and operations teams.
• Develop cost reduction projects and equipment efficiency improvements.
• Ensure compliance with Quality Management System (QMS) requirements.
• Document reports summarizing equipment availability and performance improvements.

Job Requirements

• Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering.
• Hands-on experience in semiconductor manufacturing equipment maintenance.
• Strong problem-solving and troubleshooting skills.
• Knowledge of preventive maintenance programs and reliability improvement methods.
• Familiarity with QMS processes and equipment safety standards.
• Strong communication and reporting skills.
• Vendor management experience an advantage.

6. Metrology Development Engineer

Job Description

• Develop metrology models and processes for 3D NAND technologies.
• Drive adoption of new metrology and measurement techniques.
• Collaborate with process and integration engineers for inline detection solutions.
• Analyze metrology data to identify failure signatures and drive improvements.
• Partner with HVM teams to translate future device needs into equipment roadmaps.
• Maintain Model of Record (MOR) accuracy to support technology ramps.
• Influence supplier equipment development to support future technology nodes.

Job Requirements

• Bachelor’s or Master’s degree in Materials Science, Physics, or Engineering.
• Experience with SEM metrology and advanced measurement technologies.
• Strong analytical and data modeling skills.
• Ability to collaborate with cross-functional and supplier teams.
• Knowledge of NAND or memory device technologies an advantage.
• Strong communication and technical documentation skills.

7. NAND Process Integration Engineer

Job Description

• Design, develop, and integrate innovative process solutions for 3D NAND products.
• Identify module deficiencies and technology gaps, and lead cross-functional improvements.
• Define CSPEC criteria to optimize product performance.
• Coordinate experiments and conversions at manufacturing sites.
• Lead development projects for new integration schemes and technology nodes.
• Present findings and align stakeholders during yield summits and reviews.
• Transfer new technologies from R&D to manufacturing and support ramp-up.
• Document and train manufacturing teams on new module fundamentals.

Job Requirements

• Bachelor’s or Master’s degree in Electrical, Chemical, or Materials Engineering.
• Experience in process integration and semiconductor manufacturing.
• Strong problem-solving and cross-functional leadership skills.
• Knowledge of yield improvement methodologies and CSPEC criteria.
• Proven project management and communication skills.
• Prior NAND or memory process integration experience preferred.

8. Probe Integration Engineer

Job Description

• Deploy wafer probe equipment and processes globally, with emphasis on HBM.
• Collaborate with global teams to standardize probe processes.
• Engage equipment suppliers to resolve quality and performance issues.
• Establish metrics to drive equipment performance improvements.
• Develop and integrate first-of-a-kind equipment and processes into HVM.
• Conduct statistical analysis of manufacturing data for quality control.
• Generate equipment specifications for safety and capability compliance.
• Facilitate global site meetings and cross-functional collaboration.

Job Requirements

• Bachelor’s degree in Electrical, Mechanical, or Semiconductor Engineering.
• Experience in wafer probe processes and equipment preferred.
• Strong problem-solving and data analysis skills.
• Ability to work across global teams and vendors.
• Knowledge of probe card/tester systems an advantage.
• Strong documentation and presentation skills.

9. Process & Equipment Engineer

Job Description

• Diagnose and resolve equipment and assembly process issues.
• Lead process, equipment, and material evaluation/optimization projects.
• Participate in yield improvement and cost reduction initiatives.
• Validate and implement new processes, tools, and materials for NPI.
• Train and mentor technicians on process fundamentals.
• Manage SPC/FDC systems and spare parts.
• Audit and collaborate with material suppliers for quality and cost goals.
• Support internal and external audits.

Job Requirements

• Bachelor’s degree in Mechanical, Materials, or Electrical Engineering.
• Strong experience in process engineering and equipment troubleshooting.
• Knowledge of FMEA, SPC, 8D, and other problem-solving methods.
• Strong analytical, organizational, and project management skills.
• Excellent communication and training capabilities.
• Experience with supplier management preferred.

10. Real Time Defect Analysis Engineer

Job Description

• Develop and optimize processes to improve product quality and yield.
• Perform defect analysis, root cause investigations, and risk assessments.
• Evaluate and implement new equipment and materials for defect reduction.
• Lead yield improvement and cost reduction initiatives.
• Troubleshoot wafer fabrication issues and collaborate across process areas.
• Ensure products meet design and performance specifications.
• Conduct long-term investigations on defect issues and propose solutions.
• Research and recommend process or equipment modifications for efficiency.

Job Requirements

• Bachelor’s degree in Materials, Chemical, or Electrical Engineering.
• Knowledge of FMEA, SPC, and 8D methodologies.
• Experience in defect analysis and wafer fabrication processes.
• Strong problem-solving and troubleshooting skills.
• Ability to work across teams and manage complex investigations.
• Strong communication and reporting skills.

11. Test Equipment Engineer

Job Description

• Improve test equipment availability and efficiency using FMEA and CI methods.
• Manage spare inventory for cost efficiency and uptime.
• Track equipment performance metrics and generate reports.
• Automate data collection and perform assessments to reduce yield loss.
• Support manufacturing staff and lead shift technicians to achieve output and quality.
• Qualify new tester setups and coordinate with logistics and facilities.
• Debug equipment failures and implement timely solutions.
• Support new product runs, application deployment, and validation testing.
• Drive continuous improvement projects to enhance equipment performance.
• Prepare and conduct training, certifications, and performance management for team members.

Job Requirements

• Bachelor’s degree in Electrical, Mechanical, or Test Engineering.
• Experience in test equipment support and qualification.
• Strong problem-solving and troubleshooting skills.
• Knowledge of FMEA, SPC, and continuous improvement methodologies.
• Excellent teamwork, leadership, and training skills.
• Proficiency in data analysis and automation tools.
• Prior semiconductor test engineering experience preferred.